GlobalFoundries (GF) has announced a strategic partnership with Singapore’s Agency for Science, Technology and Research (A*STAR) to advance semiconductor packaging technologies. This collaboration, formalised through a Memorandum of Understanding (MOU), will see GF leveraging A*STAR’s state-of-the-art research and development facilities and technical support to enhance its capabilities in advanced packaging.
The initiative comes as the semiconductor industry faces increasing demand for artificial intelligence (AI) and data-intensive applications, necessitating compact, high-performance, and energy-efficient solutions. Under the MOU, A*STAR will provide GF with access to its R&D resources, whilst GF will supply critical equipment to bolster A*STAR’s research efforts. This partnership aims to accelerate GF’s development of advanced packaging solutions, enabling the company to offer comprehensive semiconductor chip services at its Singapore facility.
Gregg Bartlett, GF’s Chief Technology Officer, highlighted Singapore’s robust semiconductor ecosystem as an ideal environment for innovation, stating, “This aligns to our global advanced packaging roadmap and reinforces our commitment to deliver more energy-efficient essential chips that are crucial for our customers, especially in the AI era.”
The collaboration also focuses on workforce development, with initiatives to upskill GF employees in advanced packaging. Terence Gan, Executive Director at A*STAR Institute of Microelectronics, emphasised the importance of public-private R&D collaboration in maintaining Singapore’s competitive edge in the global semiconductor supply chain.
This partnership follows GF’s earlier announcement of a new Advanced Packaging and Photonics Centre in New York, marking significant progress in its strategic roadmap to meet global customer demand.
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