Silicon Box, a leader in semiconductor packaging, has announced the shipment of 100 million units from its flagship facility at Tampines Wafer Park, Singapore. This achievement underscores the company’s capability to scale its advanced panel-level packaging (PLP) technology, which is crucial for the growing demands of artificial intelligence (AI) and high-performance computing (HPC) applications.
The state-of-the-art facility, which began mass production in late 2023, is the largest of its kind globally. Silicon Box’s proprietary technology addresses performance, scalability, and cost challenges in traditional packaging schemes. “Achieving breakthrough results in production at high volume is a significant milestone for Silicon Box,” said Mike Han, Head of Business at Silicon Box.
The company has exceeded its previous industry-leading yield record of 99.7% at wafer scale, demonstrating its ability to execute high-volume production with high yield. “This shipment milestone demonstrates our team’s capability to execute advanced panel-level packaging at high volume,” shared JH Yee, Head of Operations.
Silicon Box’s Tampines facility achieved ISO certifications for quality, environmental, and safety management, reflecting its commitment to excellence. The company plans to expand its manufacturing capacity with a second facility in Novara, Italy, expected to begin production in 2028. This expansion aims to establish a full semiconductor value chain in Europe, serving sectors such as AI, HPC, automotive, and robotics.
As the only independent semiconductor packaging company capable of enabling chiplet architectures at panel scale, Silicon Box continues to deliver industry-leading results for its customers, offering advanced packaging solutions at a low cost.
