ASMPT, a leading provider of semiconductor and electronics manufacturing solutions, has announced a significant repeat order for eight Thermo-Compression Bonding (TCB) tools from a prominent global integrated device manufacturer. These tools will be instrumental in producing advanced client and datacentre CPUs, as the industry increasingly adopts chiplet-based architectures to meet the growing demands of heterogeneous computing.
The order underscores ASMPT’s leadership in TCB chip-to-wafer applications and highlights the strong relationship with its customer. Robin Ng, Group CEO of ASMPT, stated, “This latest achievement reinforces our established leadership in TCB chip-to-wafer applications and underscores the strength of our relationship with the customer and their confidence in ASMPT’s ability to support high-volume manufacturing.”
ASMPT’s continued momentum in TCB solutions aligns with advancements in other key growth areas, such as TCB for chip-to-substrate, high bandwidth memory, and photonics die bonders. These developments position ASMPT favourably as artificial intelligence ecosystem requirements evolve from training to inference.
Headquartered in Singapore, ASMPT is a global supplier of hardware and software solutions for semiconductor and electronics manufacturing. The company is listed on the Hong Kong Stock Exchange and is part of several key indices, including the HKEX Tech 100 Index and the Hang Seng Composite MidCap Index.
